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DuPont Signs Agreement to Develop Electronic Materials

DuPont conducts research at its Semiconductor Materials Technical Center in Taiwan

09-03-2009

In an effort to develop new semiconductor packaging technologies, DuPont Wafer Level Packaging Solutions, part of DuPont Electronic Technologies, has signed a joint-development agreement with Nippon Kayaku Co. Ltd. (NKC) and its wholly owned subsidiary, MicroChem Corp. Wafer level packaging ...

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