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DuPont Signs Agreement to Develop Electronic Materials
DuPont conducts research at its Semiconductor Materials Technical Center in Taiwan
09-03-2009
In an effort to develop new semiconductor packaging technologies, DuPont Wafer Level Packaging Solutions, part of DuPont Electronic Technologies, has signed a joint-development agreement with Nippon Kayaku Co. Ltd. (NKC) and its wholly owned subsidiary, MicroChem Corp. Wafer level packaging ...
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