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W.C. Heraeus acquires technology for the manufacture of ultra-fine-pitch solder powders from Welco Potsdam

06 Apr 2005 - In March, Heraeus acquired the business and the manufacturing technology for ultra-fine solder powders from Welco GmbH in Potsdam. This has now been announced by both companies. With this acquisition, the Circuit Materials Division of W.C. Heraeus is continuing its strategy of offering speciality materials in the semi-conductor packaging industry.
 
The continued miniaturization in the field of chip attachment has resulted in greater demand for solder pastes with very fine solder powders which can no longer be manufactured economically using conventional manufacturing methods. By taking over the patented technology as well as the production facilities for the manufacture of ultra-fine solder powders, Heraeus is acquiring expertise from Welco, which is unique worldwide.
 
The innovative strength of the global technology company Heraeus guarantees that Welco customers will not only receive the same ultra-fine solder powders in the unique quality they are accustomed to. Rather, the product spectrum will be expanded even further to enable the customers themselves to develop future oriented new products.