Joint sales and distribution agreement of Electronic Materials for 'Wafer Level Packaging'

16-Feb-2007

Dynaloy LLC and BASF AG announced that they have entered into an expanded sales and distribution agreement for strippers and cleaners used in the IC (integrated circuit) industry for wafer level packaging and bumping steps. This agreement will enrich BASF's product portfolio for the semiconductor industry and will give Dynaloy access to key markets in Asia and Europe.

According to the company, the new agreement is a further step in BASF's expanding activities in the electronic materials markets. It targets the area of wafer level packaging, which is one of the final steps in microchip production that uses contact pads rather than pins or wires to connect integrated circuits. Dynaloy has developed a portfolio of pecialized chemical formulations for this process.

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