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BT-Epoxy belongs to the group of of thermoset resins used in printed circuit boards (PCB's). It is a mixture of epoxy resin, a common raw material for PCB's and BT resins. BT stands for Bismaleimide-Triazine resin. This is upon its turn a mixture of Bismaleimide, which as such is also used as a raw material for PCB's and Cyanate Ester. Three cyano groups of the cyanate ester are trimerized to a triazine ring structure, hence the T in the name. In presence of a bismaleimide the double bond of the maleimide group can copolymerize with the cyano groups to heterocyclic 6-membered aromatic ring structures with two nitrogen atoms (pyrimidines). The cure reaction occurs at temperatures up to 250 degrees C, and is catalyzed by strongly basic molecules like Dabco (diazabicyclooctane_ and 4-DMAP (4-dimethylaminopyridin). Products with very high glass transition temperatures (Tg)- up to 300 dgrees C - and very low dielectric constant can be ontained. These properties make these materials very attractive for use in PCB's.
|This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "BT-Epoxy". A list of authors is available in Wikipedia.|