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BT-Epoxy belongs to the group of of thermoset resins used in printed circuit boards (PCB's). It is a mixture of epoxy resin, a common raw material for PCB's and BT resins. BT stands for Bismaleimide-Triazine resin. This is upon its turn a mixture of Bismaleimide, which as such is also used as a raw material for PCB's and Cyanate Ester. Three cyano groups of the cyanate ester are trimerized to a triazine ring structure, hence the T in the name. In presence of a bismaleimide the double bond of the maleimide group can copolymerize with the cyano groups to heterocyclic 6-membered aromatic ring structures with two nitrogen atoms (pyrimidines). The cure reaction occurs at temperatures up to 250 degrees C, and is catalyzed by strongly basic molecules like Dabco (diazabicyclooctane_ and 4-DMAP (4-dimethylaminopyridin). Products with very high glass transition temperatures (Tg)- up to 300 dgrees C - and very low dielectric constant can be ontained. These properties make these materials very attractive for use in PCB's.

This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "BT-Epoxy". A list of authors is available in Wikipedia.
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