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Fluorosilicate glass

Fluorosilicate glass (FSG) is a dielectric used in between copper metal layers during silicon integrated circuit fabrication process. It has a low dielectric constant (k) and is now widely adopted by semiconductor foundries on geometries sub 0.25u, also Intel started using Cu metal layers and FSG on its 1.2GHz Pentium processor at 130nm CMOS. TSMC (Taiwan Semiconductor Manufacturing Company) brought in FSG and copper together in the Altera APEX.

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This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "Fluorosilicate_glass". A list of authors is available in Wikipedia.
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