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Additional recommended knowledge
These materials have relatively low melting temperatures, and can be flowed by heating in order to "planarize" the semiconductor layers. There will typically be contact holes or vias etched into the glass layers using wet etching or dry etching, and the silicate glasses can then be reflowed by heating in order to make smoother tops to the contact holes or vias, which makes the metal connections into the contact holes or vias more durable.
The silicate glasses are typically formed of phosphosilicate glass (PSG) or borophosphosilicate glass (BPSG). The boron and/or phosphorus impurity levels used can be adjusted to affect the silicate glass's melting point.
|This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "Silicate_glass". A list of authors is available in Wikipedia.|