To use all functions of this page, please activate cookies in your browser.
With an accout for my.chemeurope.com you can always see everything at a glance – and you can configure your own website and individual newsletter.
- My watch list
- My saved searches
- My saved topics
- My newsletter
Cleavage, in mineralogy, is the tendency of crystalline materials to split along definite planes, creating smooth surfaces, of which there are several named types:
This is of technical importance in the electronics industry and in the cutting of gemstones. While precious stones are generally cleaved by impact, man-made single crystals of semiconductor materials are generally sold as thin wafers which are much easier to cleave. Simply pressing a silicon wafer against a soft surface and scratching its edge with a diamond scribe is usually enough to cause cleavage; however, when dicing a wafer to form chips, a procedure of scoring and breaking is often followed for greater control. Elemental semiconductors (Si, Ge, and diamond) are diamond cubic, a space group for which octahedral cleavage is observed. This means that some orientations of wafer allow near-perfect rectangles to be cleaved. Most other commercial semiconductors (GaAs, InSb, etc.) can be made in the related zinc blende structure, with similar cleavage planes.
|This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "Cleavage_(crystal)". A list of authors is available in Wikipedia.|