To use all functions of this page, please activate cookies in your browser.
With an accout for my.chemeurope.com you can always see everything at a glance – and you can configure your own website and individual newsletter.
- My watch list
- My saved searches
- My saved topics
- My newsletter
Physical vapor deposition
Physical vapor deposition (PVD) is a general term used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of the material onto various surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high temperature vacuum evaporation or plasma sputter bombardment rather than a involving a chemical reaction at the surface to be coated as in chemical vapor deposition. The term physical vapor deposition appears originally in the 1966 book “Vapor deposition” by CF Powell, JH Oxley and JM Blocher Jr but Michael Faraday was using PVD to deposit coatings as far back as 1838.
Additional recommended knowledge
Variants of PVD include, in order of increasing novelty:
Leading consumers of PVD tools for fabrication include Intel, Samsung, and Taiwan Semiconductor.
Some of the techniques used to measure the physical properties of PVD coatings are
See thin-film deposition for a more general discussion of this class of manufacturing technique.
Physical vapour deposition is often used to produce implant-grade and autoclavable body jewellery that is black. Biocompatible titanium coating is vapourized in an arc then electrically deposited on stainless steel jewellery.
|This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "Physical_vapor_deposition". A list of authors is available in Wikipedia.