Nanodevice, build thyself
Multitude electronic interactions govern the encounter between porphine and Cu and Ag surfaces
20-Jan-2016 -
As we continue to shrink electronic components, top-down manufacturing methods begin to approach a physical limit at the nanoscale. Rather than continue to chip away at this limit, one solution of interest involves using the bottom-up self-assembly of molecular building blocks to build nanoscale ...
copper
nanostructures
self assembly
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