Honeywell expands semiconductor packaging research and development facility
Honeywell Electronic Materials announced it will expand its Spokane, Wash.-based research and development center, which is dedicated to developing critical advanced packaging materials for semiconductor manufacturers, including thermal management, electrical interconnect and burn-in materials.
As part of the expansion, Honeywell will invest more than $1 million in the facility and equipment. The project, to be completed by the end of 2007, will add approximately 85 new pieces of state-of-the-art equipment, allowing for, among other things, expanded and enhanced thermal interface material mixing and characterization, analytical and application testing, thermal and reliability testing, and failure analysis. The expansion will also include a complete metrology lab, allowing Honeywell to replicate customer manufacturing obstacles and test for solutions.
Other news from the department research and development
