Printed Electronics: Still Huge challenges – and opportunities
Glass based devices perform much better in both cases of OLED and OPV, since the glass provides good barrier properties against those “enemies”. For flexible, polymer based substrates, the situation is quite different, and special coatings and lamination techniques are required to protect the sensible organic materials.
IDTechEx is following the progress in this field closely, and at the next conference dedicated to recent achievements and development in the field of printed electronics, Printed Electronics Asia, Dr Harry Zervos will give an update of what is going on and what is still needed. Printed Electronics Asia will take place from September 30-October 1, with Masterclasses being held on September 29 and October 2 at the Sheraton Miyako Hotel in Tokyo, Japan.
Most read news
Other news from the department business & finance
Get the chemical industry in your inbox
From now on, don't miss a thing: Our newsletter for the chemical industry, analytics, lab technology and process engineering brings you up to date every Tuesday and Thursday. The latest industry news, product highlights and innovations - compact and easy to understand in your inbox. Researched by us so you don't have to.