ATMI and Enthone enter into strategic partnership

Focus on copper deposition materials for semiconductor aplications

21-May-2003
ATMI, Inc. and Enthone, Inc., a Cookson Electronics Company, announced today that they had established a strategic partnership in copper deposition materials for the semiconductor market. Under terms of the agreement, ATMI will gain exclusive worldwide rights to the products and services related to copper electrochemical deposition (Cu ECD) -- including the ViaForm(R) copper damascene materials, which Enthone will continue to manufacture. (R) ViaForm is a registered trademark of Enthone, Inc. "This clearly is a customer-focused partnership between two semiconductor application specialists," Corbett added. "The combination of Enthone's R&D resources coupled with ATMI's global support team of more than 300 sales and process experts will bring enabling technologies to customers efficiently. In essence, we're aligning two very compatible infrastructures to deliver best-in-class chemistry, metrology, and materials delivery systems worldwide."

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