Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials
23-May-2022 -
Arieca Inc., the leader in liquid-metal based thermal interface materials(TIMs) for high performance computing and high power semiconductor devices, announced a $6.5 million Series A funding round co-lead by Nissan Chemical Corporation and 412 Venture Fund, with participation from ROHM Co. Ltd., ...
liquid metals
semiconductor industry
Series A financing