BASF collaborates with IMEC on integrated circuit development

Semiconductor manufacturing processes simplified


BASF announced that it has joined IMEC's Industrial Affiliation Program to research and develop innovative cleaning solutions and advanced interconnects for the integrated circuit (IC) industry. The new cleaning solutions shall lead to increased performance and reduced complexity in the manufacturing of semiconductors based on 32-nanometer (nm) technology as well as future technologies.

"BASF is committed to providing intelligent solutions for our customers. That is why our strategy is to work with top partners in the world on the next generation technology for the IC industry," said Dr. Andreas Klipp, Manager of Development of Semiconductor Materials Europe of BASF Electronic Materials. "IMEC is the leading research institution in this field and is cooperating with major tool makers and semiconductor producers. By combining IMEC's strengths with BASF's broad chemical and application know-how, we can develop innovative cleaning solutions for enabling IC manufacturing processes using 32-nm technology."

The new chemical cleaning solutions are expected to be commercialized with the introduction of 32-nm technology in 2010.

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