Dow Corning introduces new plasma processing technology at European Coatings Show
At the European coatings Show in Nürnberg, Germany, Dow Corning plasma Solutions will introduce a new plasma processing technology that allows for the development of a wide range of super-functional, high molecular weight, and even bio-functional, nano-coatings that can be deposited on materials by room temperature plasma without the need for vacuum equipment.
As a highly aggressive medium that attacks and breaks up molecular species, the use of plasma to put down functional coatings has historically been limited to elements or low molecular weight compounds such as silica and similarly sized inorganics. Because of this, outside of highly specialized applications able to use these simple coatings (such as microelectronics), industry has been slow to widely adopt plasma processing despite its many advantages.
According to Tony Herbert, marketing manager for Dow Corning Plasma Solutions, Dow Corning's unique plasma surface engineering technique utilizes an innovative nano-coating process that sprays atomized droplets of liquid precursor directly into the room-temperature plasma at atmospheric pressure.
"Other plasma processing systems rely upon gas state precursors or apply liquid to the substrate either before or after, but not in, the plasma," said Herbert. "Because the number of liquid state precursors is vastly higher than gas state precursors, Dow Corning's proprietary technology solution provides users with a larger range of surface engineering chemistries and properties than other surface engineering techniques. Furthermore, we have found that plasma generally does not damage or destroy the precursor molecules when in the liquid state so that all the properties, functionality and value of the original precursor are delivered in the form of a polymerized, cross-linked and well-adhered nano-coating."
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